SMART
COMP
2022
June 20-24, 2022
Aalto University, Espoo, Finland
Important Dates
Workshop proposals: 1.12.2021
Main track: 12.3.2022
Industry track: 18.3.2022
Tutorials: 10.4.2022
WiP/Demo (ext.): 29.4.2022
PhD forum (ext.): 29.4.2022
N2Women
: 15.4.2022
Previous Conferences
SMARTCOMP 2021
SMARTCOMP 2020
SMARTCOMP 2019
SMARTCOMP 2018
SMARTCOMP 2017
SMARTCOMP 2016
SMARTCOMP 2014
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IEEE SMARTCOMP 2022 Organizers
General Co-Chairs
Valérie Issarny, INRIA Paris, France
Stephan Sigg, Aalto University, Finland
Technical Program Committee Co-Chairs
Chiara Boldrini, IIT-CNR, Italy
Simone Silvestri, University of Kentucky, USA
Workshop Co-Chairs
Carlo Giannelli, University of Ferrara, Italy
Dirk Pesch, University College Cork, Ireland
Work-in-Progress and Demo Co-Chairs
Sandip Chakraborty, IIT Kharagpur, India
Franca Delmastro, IIT-CNR, Italy
PhD Forum Co-Chairs
Stephen Lee, University of Pittsburgh, USA
Yu Xiao, Aalto University, Finland
Tutorial Co-Chairs
Christian Becker, University of Mannheim, Germany
Takuya Maekawa, Osaka University, Japan
Keynote Chair
Paolo Ciancarini, University of Bologna, Italy
Panel Co-Chairs
Mohan Kumar, Rochester Institute of Technology, USA
Bhaskar Krishnamachari, University of Southern California, USA
Publication Chair
Chenghsin Hsu, National Tsinghua University, Taiwan
Industry Track Co-Chairs
Sameera Palipana, Nokia, Finland
Gürkan Solmaz, NEC Europe Labs, Germany
Abhishek Mukherji, Accenture, USA
N2Women Co-Chairs
Qi Han, Colorado School of Mines, USA
Sara Khalifa, CSIRO, Australia
Publicity Chair
Eirini Eleni Tsiropoulou, University of New Mexico, USA
Web Chair
Le Ngu Nguyen, Aalto University and University of Oulu, Finland
Social Media Co-Chairs
Ella Peltonen, University of Oulu, Finland
Chenren Xu, Peking University, China
Registration & Finance Chair
Maciej Zawodniok, Missouri University of Science and Technology, USA
Steering Committee
Giuseppe Anastasi, University of Pisa, Italy
Jiannong Cao, Hong Kong Polytechnic University, Hong Kong
Sajal K. Das, Missouri University of Science and Technology, USA
Design by
Mike Pierce
© Conference Organizers